New! Comes with 1 bar weighing at 1.75 lbs
K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.
Kester K100LD Features:
Lowest dissolution of Copper from boards and components
Bright, smooth solder joints similar to Sn63Pb3
Silver-Free Lead-Free alloy
Excellent through-hole penetration and top side fillets with virtually no bridging
Reduced leaching of solder pot metals
Lead level specified at <0.05% insure RoHS compliance
Kester K100LD Features:
Lowest dissolution of Copper from boards and components
Bright, smooth solder joints similar to Sn63Pb3
Silver-Free Lead-Free alloy
Excellent through-hole penetration and top side fillets with virtually no bridging
Reduced leaching of solder pot metals
Lead level specified at <0.05% insure RoHS compliance
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Dixon Sales and Products LLC